Not all plastic enclosures are created equal, especially when it comes to electronics. Electronic housings are thermal barriers, protect against impact and chemicals and sometimes manage electromagnetic interference (EMI). In many cases, they also need to be consumer-ready.
Some material properties to consider for electronics housing injection molding include:
- Heat Resistance: Many devices generate heat during operation. Materials must withstand high temperatures without warping or degrading.
- Electrical Insulation: Most electronic housings need to insulate users and internal components from electric currents.
- Impact Strength: Devices can be dropped, kicked or exposed to rough handling in the field. A strong enclosure keeps internal components safe.
- Chemical Resistance: Industrial and medical devices are often cleaned with harsh agents or exposed to oils, solvents or moisture.
- Regulatory Compliance: Materials used may need to meet specific UL ratings or FDA requirements depending on the application.
- Aesthetic Requirements: For consumer electronics, the final look and feel such as gloss, color and texture can enhance and differentiate the product.
Balancing Performance, Cost and Moldability
The prototyping phase is the perfect time to test a few materials in small runs. In this phase, parts can be produced to evaluate the trade-offs between performance, cost and manufacturability of some of the following:
- Environment: Will the product be exposed to sunlight, moisture, vibration or chemicals?
- Performance Needs: Will the enclosure need to survive drops, high temperatures or EMI?
- Aesthetics: Is the product consumer-facing? Does it require a premium finish or a specific color?
- Budget: Are there cost constraints or is reliability the priority?
- Moldability: Some plastics flow better in thin walled molds or require fewer process adjustments.
Popular Plastics for Electronics Housing Injection Molding
Below are the materials most commonly used for plastic enclosures in electronics along with their strengths and trade-offs.
Material | Description | For | Pros | Cons |
ABS (Acrylonitrile Butadiene Styrene) | Affordable, easy to mold, and has a balanced mix of impact resistance, rigidity, and electrical insulation. | Consumer electronics, Remote controls, Battery housings, Prototypes and short production runs | • Cost-effective • Good impact strength • Easy to paint or plate for cosmetic finishes | • Lower heat resistance • Moderate chemical resistance |
Polycarbonate (PC) | Tough, heat-resistant, widely used in high-performance electronics and applications where impact strength and transparency are important. | Medical devices, Lighting enclosures, Safety equipment | • Excellent toughness • High heat resistance • Transparent grades available | • More expensive than ABS • Scratches more easily unless coated |
PC/ABS Blend | Offers the strength and heat resistance of polycarbonate with the processability of ABS. | Laptop casings, Automotive electronics, High-end consumer devices | • Balanced strength and flexibility • Improved heat resistance over ABS • UL 94 V-0 flame-retardant grades available | • More expensive than standard ABS • Moisture sensitivity during molding |
Nylon (Polyamide) | Known for toughness and excellent chemical resistance. | Under-the-hood electronics, Connectors and gear housings, Wear-and-tear environments | • High mechanical strength• Excellent wear resistance • Resistant to many chemicals | • Absorbs moisture (affects dimensions) • Requires precise drying before molding |
PBT (Polybutylene Terephthalate) | Durable, heat-resistant, great dimensional stability, and inherent flame retardancy. | Electrical connectors, Sensor housings, Industrial electronics | • High heat resistance • Good dielectric properties • Low moisture absorption | • Brittle in cold temperatures • Not ideal for high-impact needs |
Polypropylene (PP) | Lightweight, affordable, moisture resistant. Not ideal for complex enclosures, but useful for simpler or disposable electronic products. | Budget electronics, Disposable medical devices, Moisture-sensitive environments | • Cheap • Good chemical resistance • Flexible | • Poor structural rigidity, especially under heat • Not suited for precision components |
Conductive and EMI Shielded Plastics | Plastics with conductive fillers (like carbon or metal fibers) used for EMI shielding. | Communication devices, Medical electronics, EMI-sensitive instruments | • Eliminates need for separate shielding components • Reduces assembly steps • Meets EMI shielding standards | • More expensive • Requires tight process control |
Why Prototyping Enclosures Matters
In most product development cycles, the first version of an injection molded enclosure isn’t the last. Testing is essential to ensure the design, tolerances and material selection are all working together. At Protoshop, prototypes are not just placeholders, they are production quality. This allows for:
- Mechanical fit and assembly testing
- Heat resistance and material flow testing
- Surface finish, appearance and tactile feel evaluation
- Comparing multiple materials without committing to full production tooling
- Proof of concept or pilot production both benefit from rapid prototyping which allows for early and frequent enclosure design validation.
Partner with Protoshop for Expert Electronics Housing Solutions
Injection molded plastic enclosures are critical to the safety, durability and performance of electronic devices. There is no one-size-fits-all answer when it comes to choosing the right plastic. What works for a handheld remote might not work for an industrial sensor or vice versa.
Knowing the strengths and limitations of common plastics and working with an experienced prototyping partner makes it easier to choose the right material from the start.
Protoshop Inc. is a prototype injection molder, helping clients go from design to prototype to production of their electronic housings (among other parts) with expert guidance every step of the way.
Contact Protoshop today for help choosing the right material for your electronic enclosure.